On Dec 5, the latest report “Global Automobile ToF Driver IC Market 2026 by Manufacturers, Regions, Types and Applications, Forecast to 2032” from Global Info Research provides a detailed and comprehensive analysis of the global Automobile ToF Driver IC market. The report provides both quantitative and qualitative analysis by manufacturers, regions and countries, types and applications. As the market is constantly changing, this report explores market competition, supply and demand trends, and key factors that are causing many market demand changes. The report also provides company profiles and product examples of some of the competitors, as well as market share estimates for some of the leading players in 2026.
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According to our (Global Info Research) latest study, the global Automobile ToF Driver IC market size was valued at US$ 47.0 million in 2025 and is forecast to a readjusted size of USD million by 2032 with a CAGR of % during review period.
ToF (Time-of-Flight) is a 3D sensing technology that calculates the distance and depth between objects by measuring the time of flight of light. It is a technology that recognizes the three-dimensional effect, spatial information and motion of an object by calculating the distance to the object after measuring the time of the reflected signal by sending infrared wavelengths to the object, so it is applied to Augmented Reality (AR) and Virtual Reality (VR).
The automobile ToF driver IC is a core control chip dedicated to the vehicle-mounted time-of-flight (ToF) system, responsible for converting digital signals into high-precision electrical pulses to drive the laser emitter (VCSEL/EEL). It is mainly used in two scenarios: long-distance target detection in LiDAR and low-power 3D imaging in cabin monitoring (DMS/gesture recognition). It is the “light pulse engine” of the intelligent car perception system.
The automobile ToF driver IC market is growing rapidly driven by both autonomous driving and in-cabin intelligence. As the core sensor for L3+ autonomous driving, LiDAR drives the demand for high-power driver ICs, with technical barriers concentrated on GaN/SiC processes and automotive-grade reliability (AEC-Q100). In-cabin ToF cameras are required to be installed due to safety regulations (such as DMS), which promotes the popularization of medium and low-power driver ICs. International manufacturers dominate the high-end market (Infineon’s LiDAR driver ICs, ams and OSRAM’s in-cabin solutions), and Chinese manufacturers are accelerating local substitution. Future competition will focus on high power, narrow pulse width, and low cost, and the process of domestic substitution will continue to accelerate. Europe is the world’s largest market with over 50% market share, followed by Asia-Pacific and North America with nearly 25% and 15% respectively.
This report is a detailed and comprehensive analysis for global Automobile ToF Driver IC market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approval.
Automobile ToF Driver IC market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type: dToF Driver IC、 iToF Driver IC
Market segment by Application: Passenger Car、 Commercial Vehicle
Major players covered: Melexis、 Infineon、 ams、 Sony、 OnSemi、 Silicon Integrated、 OPNOUS、 PhotonIC
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Automobile ToF Driver IC product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Automobile ToF Driver IC, with price, sales quantity, revenue, and global market share of Automobile ToF Driver IC from 2021 to 2026.
Chapter 3, the Automobile ToF Driver IC competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Automobile ToF Driver IC breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment Automobile ToF Driver IC the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the Automobile ToF Driver IC sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2025.and Automobile ToF Driver IC market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Automobile ToF Driver IC.
Chapter 14 and 15, to describe Automobile ToF Driver IC sales channel, distributors, customers, research findings and conclusion.
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Automobile ToF Driver IC
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
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