On Dec 4, Global Info Research released “Global Packaging Substrates Market 2026 by Manufacturers, Regions, Type and Application, Forecast to 2032″. This report includes an overview of the development of the Packaging Substrates industry chain, the market status of Packaging Substrates Market, and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Packaging Substrates.
According to our (Global Info Research) latest study, the global Packaging Substrates market size was valued at US$ 13605 million in 2025 and is forecast to a readjusted size of USD million by 2032 with a CAGR of % during review period.
IC packaging substrates, also known as IC substrates, package substrates or IC carrier boards, are high-density organic baseboards that sit between bare semiconductor dies and the system PCB, forming a miniaturized “bridge” that fans out the die’s fine-pitch I/Os to the coarser pitch of the motherboard while providing mechanical support, thermal paths and electrical performance optimization.
Structurally, mainstream products include several families: Flip-Chip BGA (FCBGA) substrates, typically using ABF or high-performance BT laminates with 8–16 or more build-up layers, targeted at high-end CPUs, GPUs, FPGAs, ASICs and AI accelerators used in servers and networking equipment; FC-CSP/WLCSP/WBCSP chip-scale substrates, smaller and with fewer layers, widely adopted for mobile application processors, basebands, PMICs, RF transceivers and memory devices in smartphones and consumer products; wire-bond BGA (WB-BGA) substrates for cost-sensitive mid-performance devices such as MCUs, automotive logic and power management ICs; and SiP (System-in-Package) and RF-module substrates, which integrate multiple bare dies (logic/RF/memory/power) plus passives on the same organic substrate, sometimes including antennas to form AiP/AoP RF front-end modules for 5G phones, wearables, mmWave small cells and automotive radar. From a materials/platform view, IC substrates can be categorized into ABF-based, BT-based, hybrid organic/inorganic and emerging glass-core substrates, each with distinct trade-offs in routing density, dielectric performance, CTE, warpage control and cost: ABF FCBGA serves HPC/AI/server and high-end GPU markets, BT FCBGA/FC-CSP is dominant in smartphones and consumer electronics, WLCSP/WBCSP enables ultra-miniaturized SoCs and analog devices, while SiP/RF module substrates underpin highly integrated RF front-ends and multi-chip modules across mobile and IoT.
The main growth drivers can be summarized as: (i) the explosive rise of AI and high-performance computing, where we forecasts AI servers alone to consume about 20% of global ABF substrate demand by 2025 as GPUs/accelerators adopt larger substrates with more layers and I/Os; (ii) deployment of 5G and high-speed networking, which pushes switch ASICs, network processors and optical-module controllers toward higher data rates and tighter SI/PI specifications, driving demand for high-layer ABF substrates and RF SiP/RF-module substrates; (iii) growth in automotive electronics and electrification, where ADAS/AV SoCs, domain controllers and powertrain control ICs increasingly adopt BGA/FCBGA/SiP packages and thus require robust substrates with long-term reliability; and (iv) continued miniaturization and functional integration in smartphones, wearables and AR/VR, which drives adoption of WLCSP/WBCSP, PoP and SiP modules. Looking ahead, key trends include continued escalation in wiring density and package size (AI GPUs/CPUs with HBM stacks require larger organic substrates with line/space approaching 8/8 μm and toward 2/2 μm in some roadmaps), materials evolution and the rise of glass substrates (glass cores, with CTE on the order of a few ppm/°C and excellent dimensional stability, are being explored by Intel, Samsung and leading substrate makers as a potential answer to ABF warpage and scaling bottlenecks), and persistent bottlenecks in ABF films and high-end glass fabrics: Ajinomoto’s ABF is widely described as a quasi-monopoly in build-up films for advanced substrates, making it a critical failure point in the high-end packaging supply chain, while 2025 roughly 20% price hikes in BT substrates and high-end fiberglass fabrics for IC substrates amid surging AI demand and tight supply. Overall, IC substrates will remain a central “enabling infrastructure” for chip performance over the next 5–10 years, with their technology roadmap tightly coupled to advances in process nodes, HBM stacking and system-level packaging.
The IC packaging substrate industry exhibits a highly concentrated, oligopolistic structure with capacity heavily clustered in Asia. the top five IC substrate vendors—commonly listing Unimicron, Samsung Electro-Mechanics, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect Technology, LG InnoTek, Simmtech, Daeduck Electronics, AT&S, Shennan Circuit, etc. etc.—collectively hold around 80% of global market share. In ABF substrates specifically, Unimicron, Ibiden, Nan Ya PCB, Shinko, Kinsus, SEMCO and AT&S account for roughly 90% of global revenue, while BT and other organic substrates for RF and general-purpose applications are led by SEMCO, LG Innotek, Simmtech, Daeduck and other Korean and Japanese/European players. In Greater China, beyond China Taiwan’s Unimicron, Nan Ya PCB and Kinsus, mainland Chinese firms such as Shennan Circuits, Shenzhen Fastprint Circuit Tech, Zhuhai Access Semiconductor, Shenzhen Hemei Jingyi Semiconductor Technology, HOREXS and others have secured positions in AP/baseband, RF, partial automotive and networking-chip substrates, particularly in BT and mid-range ABF. At the high end, however, FCBGA/ABF substrates remain a stronghold for Japanese and Taiwanese vendors due to demanding requirements on fine line/space, multi-layer build-up, warpage control, CAF mitigation and long-term reliability. Mordor Intelligence points out that Ibiden, Shinko, ASE Technology, Unimicron and SEMCO form the core of high-end substrate supply and maintain long-term contracts with CPU and GPU leaders, while Ajinomoto’s near-monopoly in ABF resin and the dependence on Nittobo, Taiwan Glass and others for low-CTE/low-Dk glass fabrics further reinforce supply-side concentration. In response, major customers and alternative material suppliers have funded “anti-Ajinomoto” efforts, including competing build-up resins and glass-core substrates, to dilute single-vendor risk and diversify the high-end substrate ecosystem.
This report is a detailed and comprehensive analysis for global Packaging Substrates market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
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Market segment by Type: FCBGA Substrate、 FCCSP Substrate、 WB-CSP/BGA
Market segment by Application: PCs、 Server/Data Center、 AI/HPC Chips、 Communication、 Smart Phone、 Wearable and Consumer Electronics、 Automotive Electronics、 Others
Major players covered: Unimicron、 Ibiden、 Nan Ya PCB、 Shinko Electric Industries、 Kinsus Interconnect Technology、 AT&S、 Samsung Electro-Mechanics、 Kyocera、 Toppan、 Zhen Ding Technology、 Daeduck Electronics、 Zhuhai Access Semiconductor、 LG InnoTek、 Shennan Circuit、 Shenzhen Fastprint Circuit Tech、 Korea Circuit、 FICT LIMITED、 AKM Meadville、 Shenzhen Hemei Jingyi Semiconductor Technology、 Simmtech、 HOREXS、 ASE Material、 AaltoSemi
Market segment by region, regional analysis covers:
North America (United States, Canada and Mexico),
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe),
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia),
South America (Brazil, Argentina, Colombia, and Rest of South America),
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa).
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Packaging Substrates product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Packaging Substrates, with price, sales, revenue and global market share of Packaging Substrates from 2021 to 2025.
Chapter 3, the Packaging Substrates competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Packaging Substrates breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2021 to 2025.and Packaging Substrates market forecast, by regions, type and application, with sales and revenue, from 2026 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Packaging Substrates.
Chapter 14 and 15, to describe Packaging Substrates sales channel, distributors, customers, research findings and conclusion.
Data Sources:
Via authorized organizations:customs statistics, industrial associations, relevant international societies, and academic publications etc.
Via trusted Internet sources.Such as industry news, publications on this industry, annual reports of public companies, Bloomberg Business, Wind Info, Hoovers, Factiva (Dow Jones & Company), Trading Economics, News Network, Statista, Federal Reserve Economic Data, BIS Statistics, ICIS, Companies House Documentsm, investor presentations, SEC filings of companies, etc.
Via interviews. Our interviewees includes manufacturers, related companies, industry experts, distributors, business (sales) staff, directors, CEO, marketing executives, executives from related industries/organizations, customers and raw material suppliers to obtain the latest information on the primary market;
Via data exchange. We have been consulting in this industry for 16 years and have collaborations with the players in this field. Thus, we get access to (part of) their unpublished data, by exchanging with them the data we have.
From our partners.We have information agencies as partners and they are located worldwide, thus we get (or purchase) the latest data from them.
Via our long-term tracking and gathering of data from this industry.We have a database that contains history data regarding the market.
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