Global Info Research‘s report offers an in-depth look into the current and future trends in DCB and AMB Substrates, making it an invaluable resource for businesses involved in the sector. This data will help companies make informed decisions on research and development, product design, and marketing strategies. It also provides insights into DCB and AMB Substrates’ cost structure, raw material sources, and production processes. Additionally, it offers an understanding of the regulations and policies that are likely to shape the future of the industry. In essence, our report can help you stay ahead of the curve and better capitalize on industry trends.
According to our (Global Info Research) latest study, the global DCB and AMB Substrates market size was valued at US$ 1108 million in 2025 and is forecast to a readjusted size of USD million by 2032 with a CAGR of % during review period.
This report studies the DCB and AMB Substrates.
DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic.
Active Metal Brazing (AMB) is the latest developments in ceramic substrates and offers the ability to produce Heavy Copper with a AlN (Aluminium Nitride) or SiN (Silicon Nitride). The normal metallisation process is not used as AMB involves brazing pure copper on the ceramic in a high temperature vacuum brazing process. As well as offering a high reliability substrate with unique heat dissipation. The brazing technology also enables double sided copper weights of up to 800µm on thin ceramic substrates of just 0.25mm.
The global DBC ceramic substrates market is dominated by few players like Rogers Corporation, Ferrotec, NGK Electronics Devices, KCC, Shengda Tech, BYD, Heraeus Electronics and Nanjing Zhongjiang New Material, etc. Global five players hold a share over 79.8 percent in 2024. In recent years, more and more Chinese players enter the DBC ceramic substrates market, driven by the rapid growth of new energy vehicles in China market. In future, the Chinese players will play more roles around the world.
The global key manufacturers of AMB Ceramic Substrate include Rogers Corporation, Ferrotec, BYD, Toshiba Materials, Heraeus Electronics, Denka, Proterial and Mitsubishi Materials, etc. In 2023, the global top eight players had a share approximately 85% in terms of revenue.
Currently the AMB ceramic substrates are mainly produced in Japan, Germany and China, which account for 27.3%, 24.56% and 43.5% of the market share respectively in 2023. It is expected that China’s production share will reach 57% in 2030. As NGK Electronics Devices and Ferrotec have started or built factories to produce AMB in Malaysia, Southeast Asia is expected to play an important role as a production base in the next few years.
This report is a detailed and comprehensive analysis for global DCB and AMB Substrates market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Substrate Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Our DCB and AMB Substrates Market report is a comprehensive study of the current state of the industry. It provides a thorough overview of the market landscape, covering factors such as market size, competitive landscape, key market trends, and opportunities for future growth. It also pinpoints the key players in the market, their strategies, and offerings.
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The research report encompasses the prevailing trends embraced by major manufacturers in the DCB and AMB Substrates Market, such as the adoption of innovative technologies, government investments in research and development, and a growing emphasis on sustainability. Moreover, our research team has furnished essential data to illuminate the manufacturer’s role within the regional and global markets.
The research study includes profiles of leading companies operating in the DCB and AMB Substrates Market:
The report is structured into chapters, with an introductory executive summary providing historical and estimated global market figures. This section also highlights the segments and reasons behind their progression or decline during the forecast period. Our insightful DCB and AMB Substrates Market report incorporates Porter’s five forces analysis and SWOT analysis to decipher the factors influencing consumer and supplier behavior.
Segmenting the DCB and AMB Substrates Market by application, type, service, technology, and region, each chapter offers an in-depth exploration of market nuances. This segment-based analysis provides readers with a closer look at market opportunities and threats while considering the political dynamics that may impact the market. Additionally, the report scrutinizes evolving regulatory scenarios to make precise investment projections, assesses the risks for new entrants, and gauges the intensity of competitive rivalry.
Major players covered: Rogers Corporation、 Heraeus Electronics、 Kyocera、 NGK Electronics Devices、 Toshiba Materials、 Denka、 DOWA METALTECH、 KCC、 Proterial、 Mitsubishi Materials、 Jiangsu Fulehua Semiconductor Technology、 BYD、 Bomin Electronics、 Zhejiang TC Ceramic Electronic、 Shengda Tech、 Beijing Moshi Technology、 Nantong Winspower、 Wuxi Tianyang Electronics、 Fengpeng Electronics (Zhuhai)、 Guangzhou Xianyi Electronic Technology、 Fujian Huaqing Electronic Material Technology、 Konfoong Materials International、 Chengdu Wanshida Ceramic Industry、 Littelfuse IXYS、 Zhejiang Jingci Semiconductor、 Taotao Technology、 FJ Composite、 Anhui Taoxinke Semiconductor、 Guangde Dongfeng Semiconductor、 Suzhou Aicheng Technology
DCB and AMB Substrates Market by Type: AMB Ceramic Substrates、 DBC Ceramic Substrates
DCB and AMB Substrates Market by Application: Automotive & EV/HEV、 PV and Wind Power、 Industrial Drives、 Consumer & White Goods、 Rail Transport、 Military & Avionics、 Others
Key Profits for Industry Members and Stakeholders:
1. The report includes a plethora of information such as market dynamics scenario and opportunities during the forecast period.
2. Which regulatory trends at corporate-level, business-level, and functional-level strategies.
3. Which are the End-User technologies being used to capture new revenue streams in the near future.
4. The competitive landscape comprises share of key players, new developments, and strategies in the last three years.
5. One can increase a thorough grasp of market dynamics by looking at prices as well as the actions of producers and users.
6 Comprehensive companies offering products, relevant financial information, recent developments, SWOT analysis, and strategies by these players.
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe DCB and AMB Substrates product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of DCB and AMB Substrates, with price, sales, revenue and global market share of DCB and AMB Substrates from 2020 to 2025.
Chapter 3, the DCB and AMB Substrates competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the DCB and AMB Substrates breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2020 to 2024.and DCB and AMB Substrates market forecast, by regions, type and application, with sales and revenue, from 2025 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of DCB and AMB Substrates.
Chapter 14 and 15, to describe DCB and AMB Substrates sales channel, distributors, customers, research findings and conclusion.
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