Global Info Research‘s report offers an in-depth look into the current and future trends in Liquid Photosensitive Solder Resist Ink for FPC, making it an invaluable resource for businesses involved in the sector. This data will help companies make informed decisions on research and development, product design, and marketing strategies. It also provides insights into Liquid Photosensitive Solder Resist Ink for FPC’ cost structure, raw material sources, and production processes. Additionally, it offers an understanding of the regulations and policies that are likely to shape the future of the industry. In essence, our report can help you stay ahead of the curve and better capitalize on industry trends.
According to our (Global Info Research) latest study, the global Liquid Photosensitive Solder Resist Ink for FPC market size was valued at US$ 33.09 million in 2025 and is forecast to a readjusted size of USD million by 2032 with a CAGR of % during review period.
In 2024, the production of liquid photosensitive solder mask ink for FPCs reached 450.8 tons, with an average selling price of US,616.68 per ton. Liquid photosensitive solder mask ink for FPCs is a solder mask material that can be sprayed or coated onto flexible circuit boards and cured by light. It maintains conductivity in unexposed areas, allows for subsequent processing in exposed areas, and forms a protective layer in exposed areas. The upstream components of FPC liquid photosensitive solder mask ink include resins, photoinitiators, and pigments. The global resin market is dominated by companies from Japan, South Korea, and the United States. Domestic companies have a certain share in the mid- and low-end markets, but high-end products still rely on imports. China is a major producer of photoinitiators, with production of most major photoinitiator products concentrated in China. There are many types of photoinitiators, with the most popular varieties being 907, TPO, 184, 1173, DETX, and ITX, which can be blended to meet specific needs. The pigment market is currently experiencing steady growth. China has become a major global producer and exporter of organic pigments, ranking among the top in both production and export volumes. Strengthened environmental regulations and technological innovation are driving sustainable market development, boosting the adoption of water-based systems, high-performance materials (such as synthetic mica), and environmentally friendly formulations. Taiyo Ink Mfg., a globally renowned electronic materials supplier, boasts extensive technical expertise and widespread market recognition in liquid photosensitive solder mask inks for FPCs. Its products are renowned for their high precision and reliability, particularly in high-end FPC applications. In recent years, Chinese domestic companies have made significant progress in this field. Companies like Guangxin Materials and Rongda Photosensitive have steadily narrowed the technological gap with international giants by increasing R&D investment and optimizing production processes. These companies have not only continuously improved product performance but also earned recognition in the domestic market through cost advantages and rapid responsiveness. For example, Guangxin Materials’ FPC photosensitive ink series has been applied in rigid-flex boards, backlight panels, and other applications, steadily expanding its market share. With the rapid development of the domestic FPC industry, demand for domestically produced inks is also increasing, accelerating the process of domestic substitution, providing a broad market opportunity for domestic companies.
Development Trends of Liquid Photosensitive Solder Mask Inks for FPCs
Market Demand Continues to Grow
With the rapid development of consumer electronics, new energy vehicles, the Internet of Things, and other fields, the application scenarios of FPCs (flexible printed circuit boards) continue to expand, and the demand for liquid photosensitive solder mask inks continues to increase. For example, the lightweight and thin designs of smartphones and wearable devices, as well as the electronic upgrades of new energy vehicles, all rely on the high performance and reliability of FPCs, thereby driving the growth of the solder mask ink market.
Product Performance Upgrades
Improved Thermal Shock Resistance: For temperature-sensitive applications such as new energy vehicles and aerospace, the next generation of inks will utilize novel resin systems and thermally conductive fillers to enhance thermal stress buffering and ensure stable operation in extreme temperatures.
Fast Curing Speed: By optimizing the dual-curing mechanism of light and heat and microwave-assisted technology, curing time is shortened, production efficiency is improved, and energy consumption is reduced.
Enhanced Weather Resistance: The development of fluorine-silicon modified resins and nano-ceramic composite coating technologies improves the protective performance of inks in harsh environments such as outdoor and marine environments.
Accelerating Domestic Substitution
Chinese domestic companies are continuously improving their technological capabilities, gradually narrowing the gap with international giants. In sectors such as consumer electronics and new energy, the market share of domestically produced liquid photosensitive solder mask inks for FPCs is expected to further expand, particularly in the mid- and low-end markets, where they offer cost and supply chain advantages.
Driven by Technological Innovation
Companies will increase R&D investment in new resin materials, photoinitiators, and nanotechnology, driving product development towards high performance, high precision, and intelligent capabilities. For example, self-healing microcapsule technology will enhance ink durability.
Driven by Rigid-Flexible PCB Technology
Currently, with growing demand in emerging downstream sectors such as emerging electronics, automotive electronics, artificial intelligence, and cloud computing, rigid-flexible PCBs—a combination of rigid printed circuit boards (PCBs) and flexible printed circuit boards (FPCs)—are becoming an industry trend. They are widely used in products such as mobile phone cameras, laptops, laser printers, and medical, military, and aviation applications.
This report is a detailed and comprehensive analysis for global Liquid Photosensitive Solder Resist Ink for FPC market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Our Liquid Photosensitive Solder Resist Ink for FPC Market report is a comprehensive study of the current state of the industry. It provides a thorough overview of the market landscape, covering factors such as market size, competitive landscape, key market trends, and opportunities for future growth. It also pinpoints the key players in the market, their strategies, and offerings.
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https://www.globalinforesearch.com/reports/3391825/liquid-photosensitive-solder-resist-ink-for-fpc
The research report encompasses the prevailing trends embraced by major manufacturers in the Liquid Photosensitive Solder Resist Ink for FPC Market, such as the adoption of innovative technologies, government investments in research and development, and a growing emphasis on sustainability. Moreover, our research team has furnished essential data to illuminate the manufacturer’s role within the regional and global markets.
The research study includes profiles of leading companies operating in the Liquid Photosensitive Solder Resist Ink for FPC Market:
The report is structured into chapters, with an introductory executive summary providing historical and estimated global market figures. This section also highlights the segments and reasons behind their progression or decline during the forecast period. Our insightful Liquid Photosensitive Solder Resist Ink for FPC Market report incorporates Porter’s five forces analysis and SWOT analysis to decipher the factors influencing consumer and supplier behavior.
Segmenting the Liquid Photosensitive Solder Resist Ink for FPC Market by application, type, service, technology, and region, each chapter offers an in-depth exploration of market nuances. This segment-based analysis provides readers with a closer look at market opportunities and threats while considering the political dynamics that may impact the market. Additionally, the report scrutinizes evolving regulatory scenarios to make precise investment projections, assesses the risks for new entrants, and gauges the intensity of competitive rivalry.
Major players covered: Taiyo Ink Mfg、 TAMURA、 Advance Materials Corporation、 Asahi Chemical Research Laboratory、 Alfa Chemistry、 Shenzhen RongDa、 Jiangsu Kuangshun、 New East New Materials、 Coants Electronic、 Fujian Unires、 Guangdong SQ
Liquid Photosensitive Solder Resist Ink for FPC Market by Type: Green、 Black、 White、 Yellow、 Others
Liquid Photosensitive Solder Resist Ink for FPC Market by Application: Consumer Electronics Industry、 Communications Industry、 Medical and Aviation Industry、 Automotive Industry、 Others
Key Profits for Industry Members and Stakeholders:
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Liquid Photosensitive Solder Resist Ink for FPC product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Liquid Photosensitive Solder Resist Ink for FPC, with price, sales, revenue and global market share of Liquid Photosensitive Solder Resist Ink for FPC from 2020 to 2025.
Chapter 3, the Liquid Photosensitive Solder Resist Ink for FPC competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Liquid Photosensitive Solder Resist Ink for FPC breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2020 to 2024.and Liquid Photosensitive Solder Resist Ink for FPC market forecast, by regions, type and application, with sales and revenue, from 2025 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Liquid Photosensitive Solder Resist Ink for FPC.
Chapter 14 and 15, to describe Liquid Photosensitive Solder Resist Ink for FPC sales channel, distributors, customers, research findings and conclusion.
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