Global Leading Market Research Publisher QYResearch announces the release of its latest report “Immersed Liquid-cooled Power Supply – Global Market Share and Ranking, Overall Sales and Demand Forecast 2026-2032”. Based on current situation and impact historical analysis (2021-2025) and forecast calculations (2026-2032), this report provides a comprehensive analysis of the global Immersed Liquid-cooled Power Supply market, including market size, share, demand, industry development status, and forecasts for the next few years.
For data center operators, AI infrastructure managers, and energy storage system designers, thermal management is a critical bottleneck as power densities continue to rise. Immersed liquid-cooled power supply addresses this challenge as a highly efficient heat dissipation solution that completely immerses the power supply in a non-conductive coolant. Direct contact between the liquid and heat-generating components enables rapid heat transfer, significantly improving dissipation efficiency and reducing energy consumption compared to traditional air cooling. This technology effectively addresses overheating issues in high-power density devices—data centers, AI computing clusters, energy storage systems, and supercomputing centers—while offering core advantages including increased energy efficiency (reducing cooling energy by 30–50%), extended equipment lifespan, and significantly reduced risk of thermal runaway.
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Market Size and Growth Fundamentals
The global immersed liquid-cooled power supply market was valued at US$ 111 million in 2025 and is projected to reach US$ 186 million by 2032, growing at a CAGR of 7.8% from 2026 to 2032. In 2024, global production reached approximately 170,000 units, with an average market price of US$ 610 per unit. Growth is driven by rising power densities in AI and HPC infrastructure, data center energy efficiency mandates, and increasing adoption of liquid cooling across high-performance computing applications.
Product Overview and Technology Advantages
Immersed liquid-cooled power supply offers transformative thermal management capabilities:
- Direct Liquid Contact: Power supply components fully submerged in dielectric coolant
- Superior Heat Transfer: Liquid removes heat 10–50× more efficiently than air
- Reduced Cooling Energy: 30–50% reduction in cooling system power consumption
- Higher Power Density: Enables 2–3× power density of air-cooled equivalents
- Extended Lifespan: Lower operating temperatures reduce component stress
- Thermal Runaway Prevention: Immediate heat removal improves safety
Key applications by sector:
- Data Centers: Power distribution units (PDUs) and server power supplies in high-density racks
- AI Computing Clusters: GPU-accelerated systems with 10–100 kW per rack power density
- Energy Storage Systems: Battery management and power conversion systems
- Supercomputing Centers: High-performance computing (HPC) installations
- Telecommunications: 5G base stations and edge computing nodes
Market Segmentation: Power Levels and Applications
The immersed liquid-cooled power supply market is segmented by power level into:
- Low Power Supply: For edge computing, telecommunications, and smaller-scale deployments. Growing segment for distributed infrastructure.
- Medium and High Power Supply: Largest and fastest-growing segment for data centers, AI clusters, and supercomputing centers where power density is highest.
By application, the market spans Internet, Government, Telecommunications, Finance, Manufacturing, and Others:
- Internet: Largest segment (approximately 40%), driven by hyperscale data centers and AI infrastructure
- Telecommunications: 5G edge computing and central office upgrades
- Finance: High-frequency trading and data center infrastructure
- Government: Defense, research, and supercomputing installations
- Manufacturing: Industrial automation and high-power equipment
Competitive Landscape: Key Players
The immersed liquid-cooled power supply market features specialized power supply manufacturers and cooling technology integrators:
| Company | Key Strengths |
|---|---|
| Vertiv | Data center infrastructure leader; integrated liquid cooling solutions |
| FSP Technology | Power supply specialist; immersed cooling product line |
| Toshiba | Industrial electronics; high-power supply expertise |
| Kehua | Chinese power supply manufacturer; domestic market presence |
| Honoto | Regional specialist; cost-competitive solutions |
Recent Developments (Last 6 Months)
Several developments have shaped the immersed liquid-cooled power supply landscape:
- AI Infrastructure Boom: December 2025–January 2026 saw record deployments of GPU-accelerated AI clusters (NVIDIA H100/B100, AMD MI300), with power densities exceeding 100 kW per rack driving liquid cooling adoption for both servers and power supplies.
- Data Center Energy Mandates: Updated ASHRAE guidelines and EU Energy Efficiency Directive requirements accelerated liquid cooling adoption to meet Power Usage Effectiveness (PUE) targets below 1.2.
- Coolant Innovations: New dielectric fluids with higher thermal conductivity and lower viscosity improved heat transfer efficiency and reduced pumping power requirements.
- Standardization Efforts: Open Compute Project (OCP) liquid cooling standards expanded to include immersed power supply specifications, enabling multi-vendor compatibility.
Exclusive Insight: Low vs. Medium/High Power Immersed Cooling—Application Scale Drives Adoption
A critical market dynamic is the divergence between low-power and medium/high-power immersed liquid-cooled power supplies based on deployment scale and power density.
Low-Power Segment (edge, telecom, smaller deployments) is characterized by:
- Lower Power Density: 500W–3kW per unit
- Simpler Implementation: Smaller form factor, less complex cooling loops
- Applications: Edge data centers, 5G base stations, distributed infrastructure
Medium/High-Power Segment (fastest-growing) is characterized by:
- High Power Density: 5–50 kW per unit for data center and AI cluster applications
- Complex Integration: Requires facility-scale cooling distribution
- Applications: Hyperscale data centers, AI training clusters, supercomputing centers
A 2026 industry analysis indicated that medium/high-power segment is growing at 15%+ CAGR, driven by AI infrastructure deployment where power densities make air cooling impractical. Low-power segment is growing steadily for edge and telecommunications applications where smaller-scale cooling solutions are preferred.
Technical Challenges and Innovation Directions
Key technical considerations in immersed liquid-cooled power supply development include:
- Dielectric Compatibility: Ensuring coolants do not degrade component materials (capacitors, connectors, PCBs)
- Sealing and Leak Prevention: Fluid containment for long-term reliability
- Pumping Power: Balancing coolant circulation energy with cooling benefit
- Maintenance Access: Serviceability of immersed components
Innovation focuses on:
- Single-Phase vs. Two-Phase Cooling: Two-phase immersion (boiling) offers higher heat transfer but requires more complex system design
- Hybrid Cooling: Combining immersion for high-power components with air cooling for lower-density areas
- Fluid Formulations: Next-generation dielectric fluids with improved thermal properties and environmental profiles
- Modular Designs: Standardized form factors for multi-vendor compatibility
Conclusion
The immersed liquid-cooled power supply market is positioned for strong growth through 2032, driven by AI infrastructure expansion, data center energy efficiency mandates, and increasing power densities across computing applications. For manufacturers, success will depend on fluid compatibility, thermal design expertise, and integration with broader cooling infrastructure. As power densities continue to rise, immersed liquid-cooled power supplies will become essential for high-performance computing, AI, and next-generation data center infrastructure.
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