Global Leading Market Research Publisher QYResearch announces the release of its latest report “IoT eUICC Technology – Global Market Share and Ranking, Overall Sales and Demand Forecast 2026-2032″. Based on current situation and impact historical analysis (2021-2025) and forecast calculations (2026-2032), this report provides a comprehensive analysis of the global IoT eUICC Technology market, including market size, share, demand, industry development status, and forecasts for the next few years.
The global market for IoT eUICC Technology was estimated to be worth US$ 6213 million in 2025 and is projected to reach US$ 9411 million, growing at a CAGR of 6.2% from 2026 to 2032. IoT eUICC (embedded Universal Integrated Circuit Card) technology is a standardized, remotely programmable SIM solution designed for Internet of Things (IoT) devices. Unlike traditional SIM cards that are physically swapped to change network operators, an eUICC allows devices to switch carriers or update SIM profiles over the air (OTA) without manual intervention. This enhances flexibility, scalability, and lifecycle management for large-scale IoT deployments across multiple regions or operators. eUICC is especially valuable in applications like connected cars, smart meters, and industrial sensors, where physical access is limited and long-term connectivity is critical.
Addressing Core IoT Global Connectivity, Remote Profile Management, and Scalability Pain Points
IoT device manufacturers, enterprise IoT solution providers, and mobile network operators face persistent challenges: traditional SIM cards require physical swapping to change carriers (infeasible for deployed devices in the field), are vulnerable to environmental damage (moisture, vibration, corrosion), and complicate global deployment (multiple regional SIMs, inventory management). IoT eUICC (embedded Universal Integrated Circuit Card) technology—GSMA-standardized, remotely programmable SIMs soldered onto device hardware—has emerged as the solution for secure, over-the-air (OTA) profile management, enabling devices to switch carriers without physical access. eUICC enhances flexibility (carrier switching), scalability (single hardware SKU for global deployment), and lifecycle management (profile updates, decommissioning). However, market segmentation is complicated by two distinct categories: hardware (eUICC chips, iUICC integrated solutions) versus software and services (remote SIM provisioning (RSP) platforms, subscription management (SM-DP+, SM-SR), connectivity management). Over the past six months, new GSMA eUICC IoT specifications (SGP.31/.32), connected car mandates (eCall, EU), and smart meter deployments have reshaped the competitive landscape.
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Key Industry Keywords (Embedded Throughout)
- IoT eUICC technology
- Embedded universal integrated circuit card
- Remote SIM provisioning
- Over-the-air profile management
- Connected car smart meter
Market Landscape & Recent Data (Last 6 Months, Q4 2025–Q1 2026)
The global IoT eUICC technology market is fragmented, with a mix of telecom operators, eSIM/eUICC platform providers, and semiconductor companies. Key players include AT&T, NTT, Verizon, Telekom (Deutsche Telekom), China Mobile, China Telecom, China Unicom, Thales Group, Giesecke+Devrient (G+D), Wireless Logic, Truphone, Kigen (Arm), Infineon, Vodafone, KORE Wireless, 1NCE, BICS, Telit Cinterion, Eseye, and SIMCom.
Three recent developments are reshaping demand patterns:
- GSMA eUICC IoT specifications (SGP.31/.32) : GSMA released SGP.31 (eUICC IoT Architecture) and SGP.32 (eUICC IoT Technical Specification) in 2024-2025, standardizing remote SIM provisioning for IoT (optimized for massive IoT, lower power, smaller profile size). SGP.32 reduces eUICC profile size by 50-70%, supports NB-IoT/LTE-M, and enables device-triggered profile downloads. Adoption accelerating in 2025-2026.
- Connected car mandates: EU eCall (automatic emergency call), ERA-GLONASS (Russia), and connected car features require embedded connectivity. eUICC enables over-the-air carrier switching (pan-European roaming without multiple SIMs, local profiles for lower cost). Automotive eUICC shipments grew 15-20% in 2025.
- Smart meter and utility deployments: Utility smart meters (electricity, gas, water) require long-term (10-15 years), reliable connectivity in harsh environments (outdoor, underground). eUICC (soldered, no physical access, tamper-resistant) preferred over plastic SIM (corrosion, moisture ingress). Smart meter eUICC shipments grew 12-15% in 2025.
Technical Deep-Dive: Hardware vs. Software and Services
- Hardware (eUICC chips, iUICC integrated solutions, MFF2 soldered form factor). Advantages: tamper-resistant, vibration-proof, moisture-resistant, smaller footprint (2.5mm x 2.3mm for MFF2), and extended temperature range (-40°C to +105°C for industrial). A 2025 study from ABI Research found that MFF2 eUICC reduces device size by 30-40% vs. plastic SIM (tray, holder). Disadvantages: higher BOM cost ($0.50-2.00 vs. $0.10-0.30 for plastic SIM), requires rework to replace. Hardware accounts for approximately 30-35% of IoT eUICC market value (eUICC chip sales), dominated by Infineon, NXP, STMicroelectronics, Thales, G+D.
- Software and Services (remote SIM provisioning (RSP) platforms, subscription management (SM-DP+, SM-SR), connectivity management platform (CMP), global connectivity (roaming, local profiles)). Advantages: enables over-the-air profile switching (carrier changes without device recall), single hardware SKU for global deployment, centralized management (profile lifecycle, subscription billing), and reduced logistics cost. Services account for approximately 65-70% of market value (higher margin), dominated by telecom operators (AT&T, Verizon, Telekom, China Mobile, Vodafone), eUICC platform providers (Thales, G+D, Kigen, Truphone, Wireless Logic, KORE, 1NCE, Eseye, BICS).
User case example: In November 2025, a European utility (5 million smart electricity meters) published results from deploying GSMA SGP.32 eUICC technology (Thales, G+D, Telekom) for long-term connectivity. The 12-month study (completed Q1 2026) showed:
- eUICC hardware: MFF2 soldered (Thales), $1.50 per meter (10-year lifespan).
- Software/service: remote SIM provisioning (SGP.32), $0.50 per meter/year.
- Carrier switching: OTA profile download (Telekom to Orange to Vodafone) without meter recall.
- Single hardware SKU for EU deployment (vs. 10 SKUs with plastic SIM).
- Connectivity cost: 25% lower (local profiles vs. roaming).
- Reliability: 99.95% uptime (eUICC sealed vs. plastic SIM corrosion in outdoor meters).
- Decision: eUICC standard for all new smart meters; plastic SIM phased out.
Industry Segmentation: Discrete vs. Continuous Manufacturing
- eUICC hardware manufacturing (chip fabrication, eUICC OS programming, personalization) follows high-volume semiconductor continuous manufacturing (billions of units).
- Software and services (RSP platforms, connectivity management) are software development and telecom operations.
Exclusive observation: Based on analysis of early 2026 product launches, a new “iUICC” (integrated UICC) is emerging for ultra-compact IoT devices (wearables, sensors, asset trackers). iUICC integrates eUICC functionality directly into the device’s main processor (SoC) or modem, eliminating separate eUICC chip. iUICC reduces footprint by 50-70% (no separate component) and cost by 20-30%. Infineon (OPTIGA Connect), Kigen (with Arm), and Sony (Altair modem) launched iUICC solutions in Q1 2026. iUICC targets wearables, smart tags, and disposable IoT devices where size and cost are critical.
Application Segmentation: In-vehicle Devices, Smart Meters, Wearable Devices, Others
- In-vehicle Devices (connected cars, commercial telematics, eCall, infotainment, fleet tracking) accounts for 35-40% of IoT eUICC technology market value (largest segment). Growing at 8-10% CAGR.
- Smart Meters (electricity, gas, water meters) accounts for 25-30% of value. Growing at 6-8% CAGR.
- Wearable Devices (smartwatches, fitness trackers, medical wearables, pet trackers) accounts for 15-20% of value. Fastest-growing segment (12-15% CAGR), driven by iUICC (ultra-compact, low power).
- Others (industrial sensors, asset trackers, drones, robotics, smart city, retail POS) accounts for 15-20% of value.
Strategic Outlook & Recommendations
The global IoT eUICC technology market is projected to reach US$ 9,411 million by 2032, growing at a CAGR of 6.2% from 2026 to 2032.
- IoT device manufacturers: Deploy eUICC (MFF2 soldered) for tamper-proof, vibration-proof, moisture-resistant connectivity (industrial, automotive, smart meters). Single hardware SKU for global deployment (remote SIM provisioning). iUICC for ultra-compact devices (wearables, sensors).
- Enterprise IoT solution providers: Select GSMA-compliant remote SIM provisioning (SGP.31/.32) for over-the-air carrier switching, subscription management (SM-DP+, SM-SR), and connectivity management platform (CMP). Global connectivity partners (1NCE, KORE, Wireless Logic, Eseye, BICS) for multi-operator coverage.
- Telecom operators and MVNOs: Invest in eUICC platform (SM-DP+, SM-SR) for IoT device onboarding, profile management, and carrier switching. GSMA SGP.32 support required for massive IoT (LTE-M, NB-IoT).
- Chipset and eUICC vendors (Infineon, Thales, G+D, Kigen, NXP, ST): Invest in iUICC (integrated eUICC) for ultra-compact IoT, lower-power eUICC (for battery-powered sensors), and GSMA SGP.32 compliance.
For IoT connectivity, eUICC technology (embedded Universal Integrated Circuit Card, remote SIM provisioning) enables secure, scalable, global device deployment without physical SIM swaps. Hardware (eUICC chips) and software/services (RSP platforms, connectivity management) segments both growing. Connected cars, smart meters, and wearables are primary drivers. GSMA SGP.32 and iUICC are emerging trends.
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