Global Leading Market Research Publisher QYResearch announces the release of its latest report “SERDES IP Cores – Global Market Share and Ranking, Overall Sales and Demand Forecast 2026-2032″. Based on current situation and impact historical analysis (2021-2025) and forecast calculations (2026-2032), this report provides a comprehensive analysis of the global SERDES IP Cores market, including market size, share, demand, industry development status, and forecasts for the next few years.
The global market for SERDES IP Cores was estimated to be worth US1,650millionin2025andisprojectedtoreachUS1,650millionin2025andisprojectedtoreachUS2,850 million by 2032, growing at a CAGR of 8.1% from 2026 to 2032. For semiconductor design managers, ASIC/FPGA architects, and SoC product planners, the core business imperative lies in licensing SERDES IP cores that address the critical need for high-bandwidth, power-efficient, and low-latency chip-to-chip, chip-to-module, and backplane communication across data centers, AI accelerators, 5G infrastructure, storage systems, and automotive networks. SERDES IP stands for Serializer/Deserializer Intellectual Property—a specialized electronic design component (digital logic + analog mixed-signal) that facilitates transmission of serial data over high-speed interfaces (PCIe, Ethernet, USB, HDMI, DP, MIPI, JESD204B/C). SERDES technology converts parallel data (e.g., 64-bit @ 500 MHz = 32 Gbps) into serialized format (e.g., 1-lane 32 Gbps NRZ/PAM4) for transmission over differential pairs (PCB traces, cables, backplanes, optical modules) and then converts received serialized data back to parallel. SERDES IP incorporates necessary circuitry and algorithms: data serialization/deserialization, clock recovery (CDR), signal conditioning (equalization TX FIR (Feed-Forward Equalization), RX CTLE (Continuous Time Linear Equalization), DFE (Decision Feedback Equalization)), and error detection/correction (CRC, FEC). Primary types include high-speed SERDES (28G/56G/112G/224G PAM4), low-power SERDES (25-112G, short reach for chiplet interconnect, UCIe (Universal Chiplet Interconnect Express) Die-to-Die), long-reach SERDES (for backplane, optical modules with lossy channels), and others (automotive, radiation-tolerant). Applications span networking equipment (Ethernet switches, routers, NPUs (Network Processing Units)), storage systems (SSD controllers, NVMe (Non-Volatile Memory Express) over PCIe, RAID cards, JBOD), video and audio interfaces (HDMI, DP (DisplayPort), MIPI DSI/CSI, JESD204B/C for ADCs/DACs), and others (AI/ML accelerators (chiplet interconnects), automotive SerDes (GMSL (Gigabit Multimedia Serial Link), FPD-Link (Flat Panel Display Link), ADAS cameras, infotainment). The Global Mobile Economy Development Report 2023 (GSMA) noted 5.4 billion mobile users (2022). Communications market: US$100 billion (2022). China telecom service revenue ¥1.58 trillion (2022 +8%), fixed broadband ¥240.2 billion.
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The SERDES IP Cores market is segmented as below:
Synopsys
Xilinx (AMD)
Cadence Design Systems
Rambus
Marvell
Intel
Credo
Lattice Semiconductor
eSilicon (Inphi (Marvell), now part of Marvell)
Texas Instruments
S2C
Peraso
Semtech
Point2 Technology
Microchip Technology
Fermionic Design
Silicon Creations
M31 Technology
Microtronix
Global Unichip Corp (GUC)
Segment by Type
High-Speed SERDES
Low-Power SERDES
Long-Reach SERDES
Others
Segment by Application
Networking Equipment
Storage Systems
Video and Audio Interfaces
Others
1. Market Drivers: AI/HPC Chiplet Interconnects, 112G/224G Ethernet, and Die-to-Die
Several powerful forces are driving the SERDES IP core market:
AI and high-performance computing (HPC) chiplet interconnect – AI accelerators (NVIDIA Blackwell, AMD Instinct, Google TPU, Groq, Cerebras) moving from monolithic die to multi-die chiplet architecture. UCIe (Advanced Interface Bus (AIB), BoW (Bridge of Wires), OIF) supports 2-32 Gbps per lane (LP SERDES). Chiplet connections require ultra-low power (pJ/bit) and short reach (<10mm). UCIe 1.0 (February 2022), 1.1 (2023/2024) ratified by Intel, AMD, Arm, Google, Meta, Microsoft, Samsung, TSMC. Low-power SERDES segment growth 12-15%.
112G/224G PAM4 for Ethernet and backplane – Hyperscale data centers (Meta, Google, Amazon, Microsoft, Alibaba) upgrading to 800G (112G serial) and 1.6T (224G serial). 112G PAM4 SERDES for OSFP (Octal Small Form-factor Pluggable) and QSFP-DD (Quad Small Form-factor Pluggable Double Density). 224G PAM4 (pre-standard 1.6T Ethernet (IEEE 802.3df)). Synopsys, Cadence, Rambus, Credo, Alphawave (not listed) compete. High-speed SERDES growth 9-10% CAGR.
5G infrastructure and telecom equipment – 5G baseband (RU (Radio Unit), DU (Distributed Unit), CU (Centralized Unit)) requires JESD204B/C to connect FPGAs/ASICs to high-speed data converters (ADCs/DACs). China telecom (¥1.58tn revenue) and global telco spending. Long-reach SERDES (20-40dB insertion loss) for CPRI (Common Public Radio Interface) and eCPRI (enhanced CPRI) fronthaul.
Recent market data (December 2025): According to Global Info Research analysis, high-speed SERDES (56G/112G/224G PAM4) dominates revenue with approximately 55% share (datacenter Ethernet, AI accelerator chiplet, 5G infrastructure). Low-power SERDES (chiplet, die-to-die, MIPI) holds 25% share, fastest-growing (10-12% CAGR). Long-reach SERDES (backplane, optical module) 15% share. Others (automotive, rad-hard) 5%. Networking equipment largest application segment (45% share). Storage systems (SSD controller PCIe) 20%. Video/audio interfaces (HDMI/DP/MIPI/JESD) 20%. Others 15%. Asia-Pacific (China, Taiwan, Korea) dominates SERDES IP consumption (50%+) due to semiconductor foundry (TSMC), fabless design (Mediatek, Broadcom, Marvell). North America (30%), Europe (15%). Synopsys, Cadence market share leaders (commercial SERDES IP). Rambus, Credo, Alphawave (next).
2. Product Specifications and Key Parameters
| Type | Data Rate (max) | Modulation | Typical Reach (loss) | Power Efficiency | Applications | Share |
|---|---|---|---|---|---|---|
| High-Speed SERDES | 56G/112G (PAM4), 224G (future) | NRZ (Non-Return-to-Zero) (28G), PAM4 (56G+), PAM6 (future) | 20-40dB (backplane, optical) | 3-7 pJ/bit | Ethernet switches, AI, routers | ~55% |
| Low-Power SERDES | 2-32G (UCIe), 32-56G (die-to-die) | NRZ (UCIe), PAM4 | <10mm (chiplet, die-to-die) | <1 pJ/bit (UCIe) | AI chiplets, MCM, 2.5D/3D packaging | ~25% |
| Long-Reach SERDES | 10-56G | NRZ, PAM4 | 30-50dB (lossy backplane, long cable) | 5-10 pJ/bit | 5G fronthaul, backplane, telecom | ~15% |
Key parameters: Power efficiency (pJ/bit), jitter (random, deterministic), BER (Bit Error Rate <1e-15, FEC corrected <1e-12?), equalization (TX FIR tap count, RX CTLE gain, DFE taps), PLL (phase-locked loop) jitter generation, supply voltage (0.75-1.0V advanced node). Process node support (5nm, 3nm, 7nm, 14nm, 28nm, 55nm). SERDES IP must be ported to customer’s target foundry process (TSMC, Samsung, Intel, GlobalFoundries, SMIC, UMC).
Exclusive observation (Global Info Research analysis): The SERDES IP market is increasingly competitive with traditional EDA vendors (Synopsys, Cadence) facing new pure-play SERDES IP specialists (Rambus PHY IP from acquired (Rambus acquired PLDA, PHY IP from Northwest Logic?), Credo (high-speed 112G), Alphawave (not listed), M31 Technology (Taiwan) and GUC (Taiwan, integrated SERDES PHY with ASIC service). Hyperscale cloud providers (Meta, Microsoft, Google, AWS) developing in-house SERDES for ASICs (TPU, Inferentia, Trainium, Maia). Not licensed IP but custom internal. Threatens traditional IP vendor model.
User case – AI accelerator chiplet interconnect (December 2025): AMD MI300X AI accelerator (13 chiplets) uses UCIe low-power SERDES IP (Synopsys, Cadence) for die-to-die interconnect between compute chiplets (3nm) and I/O chiplet (6nm). UCIe spec: 32 Gbps per lane (NRZ), <1 pJ/bit power efficiency. SERDES IP supports chiplet chiplets, advanced packaging (TSMC CoWoS (Chip-on-Wafer-on-Substrate)). AMD internal design.
User case – 800G Ethernet switch ASIC (January 2026): Broadcom Tomahawk 6 (800G Ethernet switch) integrates 112G PAM4 SERDES IP (Broadcom internal, not licensed). Rival switch ASIC (NVIDIA Spectrum, Marvell Teralynx) uses Synopsys or Cadence 112G PAM4 IP. 64 ports of 800G (total 51.2 Tbps switch). SERDES consumes significant die area (30-40% of total). Power efficiency 4 pJ/bit. Competing high-speed IP.
3. Technical Challenges
Power efficiency for chiplet interconnects – UCIe target <1 pJ/bit for short-reach (10mm) die-to-die. Traditional SERDES 3-7 pJ/bit. Achieving sub-1pJ/bit requires simple equalization (CTLE not DFE), low-swing TX (200-400mV), shared PLL across multiple lanes. Advanced packaging (silicon interposer, embedded bridge) reduces channel loss.
Signal integrity for 112G PAM4 – 112G PAM4 (56G baud, 4-level signaling) requires complex equalization (DFE 8-12 taps), adaptive algorithms, and calibration. Channel loss up to 30-40dB at Nyquist (28 GHz). Crosstalk, reflections, return loss difficult. SERDES IP requires channel modeling, IBIS-AMI models for system simulation.
Technical difficulty – multi-vendor interoperability: Different SERDES IP from different vendors (Synopsys vs Cadence vs Credo) must interoperate (plug and play) at 112G PAM4 in same system (switch ASIC to optical module). Industry consortiums (Ethernet Technology Consortium (ETC), OIF) define electrical specifications (CEI-112G). Compliance testing (plugfest). Interoperability risk.
Technical development (October 2025): Credo (US) announced 224G PAM4 (224G per lane) SERDES IP on TSMC 3nm, 2nm targeting 1.6T Ethernet (pre-standard). Demonstration data rate 224 Gbps (112G baud, PAM4) using advanced equalization (DFE). Power efficiency 4.5 pJ/bit (competitive). Sampling to AI/ML and switch customers. 1.6T Ethernet expected 2027.
4. Competitive Landscape
Key players include: Synopsys (US – DesignWare SERDES IP), Xilinx (AMD) (US – FPGA SERDES, not licensed), Cadence Design Systems (US – SerDes IP), Rambus (US – PHY IP, high-speed), Marvell (US – internal, acquired Inphi), Intel (US – internal), Credo (US – high-speed SERDES), Lattice Semiconductor (US – FPGA, small SERDES), eSilicon (now Marvell), Texas Instruments (internal SERDES for ASIC), S2C (China – FPGA prototyping, not primary), Peraso (Canada – mmWave, not primary), Semtech (US – Signal Integrity), Point2 Technology (US). Microchip Technology (US), Silicon Creations (US – PLL, clock, SERDES), M31 Technology (Taiwan – memory and SERDES IP), Microtronix (Canada), Global Unichip Corp (GUC) (Taiwan – ASIC design services, SERDES IP).
Regional dynamics: US dominates SERDES IP development (Synopsys, Cadence, Rambus, Credo, Marvell). Taiwan (M31, GUC, TSMC) important. China developing domestic SERDES IP (Shanghai IP providers, Huawei internal). Europe small presence.
5. Outlook
SERDES IP cores market will grow at 8.1% CAGR to US$2.85 billion by 2032, driven by AI chiplet interconnect (UCIe), 112G/224G Ethernet (800G/1.6T), and advanced packaging (2.5D/3D). Technology trends: UCIe low-power sub-1pJ/bit; 224G PAM4 for 1.6T; integrated optical (co-packaged optics CPO) replacing electrical SERDES (future). Regional growth: Asia-Pacific (9-10% CAGR), North America (7-8%). Interconnect IP (SERDES) remains critical semiconductor enabler.
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