Global Leading Market Research Publisher Global Info Research announces the release of its latest report *“Ultrasonic Fingerprint Chip Module – Global Market Share and Ranking, Overall Sales and Demand Forecast 2026-2032”.* Based on current situation and impact historical analysis (2021-2025) and forecast calculations (2026-2032), this report provides a comprehensive analysis of the global Ultrasonic Fingerprint Chip Module market, including market size, share, demand, industry development status, and forecasts for the next few years.
For smartphone manufacturers integrating under-display fingerprint authentication, traditional optical sensors fail with advanced OLED screens featuring circularly polarized light, LTPO, and Poly-less technology due to reduced light transmittance. The ultrasonic fingerprint chip module addresses this as a complete biometric solution integrating an ultrasonic sensor chip and algorithm processing chip. This technology utilizes an ultrasonic sensor to transmit waves and receive reflected signals, generating a three-dimensional image of the user’s fingerprint for highly accurate identity authentication. Operating on the ultrasonic impedance principle, the sensor detects reflections from different media (air, skin, fingerprint ridges). Key components include the ultrasonic sensor chip (core transmit/receive), algorithm processing chip (signal processing, image generation, feature extraction), and control circuitry (system operation). In 2024, global production reached 140 million units, with an average selling price of US$9.2 per unit. With widespread adoption of smart devices and consumer demand for security and convenience, ultrasonic technology has seen unprecedented growth.
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Market Valuation & Growth Trajectory (2026-2032)
The global market for Ultrasonic Fingerprint Chip Module was estimated to be worth approximately US$ 1.59 billion in 2025 and is projected to reach US$ 5.78 billion by 2032, growing at a CAGR of 20.5% from 2026 to 2032 (Source: Global Info Research, 2026 revision). In 2024, global production reached 140 million units, with an average selling price of US$9.2 per unit. This explosive growth reflects increasing adoption in mid-range smartphones (cost reduction), displacement of optical modules, and advantages with next-gen OLED screens. Key regions: China (60% of smartphone production, module consumption), South Korea (Samsung), US (Qualcomm design). With advanced screen technologies (circularly polarized light, Poly-less), optical modules face technical conflicts preventing proper operation. Ultrasonic fingerprint recognition offers greater security, can recognize wet and oily hands, and provides significant advantages in module technical specifications. 3D ultrasonic fingerprint is a future trend, replacing optical as standard in mid-to-high-end models.
Exclusive Observer Insights (Q1-Q2 2026): Key market trends include: (1) transition from small-size sensor chips (single-point) to large-size (wide-area) for enhanced security; (2) integration of sensor and algorithm chips into single package (SiP – system-in-package) reducing footprint; (3) higher ultrasonic frequency (20MHz+ for better resolution); (4) AI-based liveness detection (anti-spoofing, 3D depth map); (5) manufacturing yield improvement through Qualcomm-Samsung Display partnership. Continuous innovation: optimizing sensor design, increasing algorithm processing speed, enhancing anti-interference. The ultrasonic sensor chip is the core component; the algorithm processing chip handles signal processing, image generation, and feature extraction; control circuitry manages overall system operation.
Key Market Segments: By Type, Application, and Chip Size
Major players include Qualcomm Technologies (US, 3D Sonic Sensor, market leader), Fingerprint Cards (Sweden), OFILM Group (China), Shenzhen S-king Intelligent Equipment, Q Technology (China), BOE Technology (China), GigaDevice (China), Shenzhen Goodix Technology Co., Ltd. (China, optical and ultrasonic), and Huawei (Chengdu Coreunion Technology Co., Ltd.) (China, in-house for Huawei phones).
Segment by Type (Sensor Chip Size / Sensing Area):
- Large-Size Ultrasonic Fingerprint Sensor Chips – Fastest-growing (approx. 35% of units, projected 60% by 2030, CAGR 28%). Sensing area 20x30mm (wide-area). Advantages: higher security (two-finger authentication), faster user experience, liveness detection. Higher cost ($15-25). Used in flagship phones (Samsung Galaxy S-series, Note, Z Fold; Xiaomi 13 series).
- Small-Size Ultrasonic Fingerprint Sensor Chips – Larger volume (approx. 65% of units). Sensing area 4x4mm to 8x8mm (single-point). Advantages: lower cost ($6-12), established technology. Used in mid-range phones. Declining share as large-size costs drop.
Segment by Application (Smartphone Tier):
- High-End Mobile Phones – Largest value (approx. 60% of revenue). Flagship models (Samsung Galaxy S, Note, Z Fold; Xiaomi Mi/13 series; Huawei P/Mate; Google Pixel; Vivo X series; OnePlus). Use large-size chips ($15-25). Volume 200-300 million units/year.
- Mid-Range Mobile Phones – Larger volume, lower ASP (approx. 40% of revenue). Phones $300-600. Use small-size chips ($6-12). Volume 300-400 million units/year. Growing as costs decrease.
Industry Layering: Ultrasonic vs. Optical vs. Capacitive Fingerprint Modules
| Feature | Ultrasonic (In-Display) | Optical (In-Display) | Capacitive (Physical Button) |
|---|---|---|---|
| Screen compatibility | All OLED (circularly polarized, Poly-less) | Limited (standard OLED only) | N/A (not under display) |
| Wet/oily hand | Excellent | Poor | Poor |
| Security (spoofing) | High (3D depth, liveness) | Medium (2D) | High (capacitance) |
| Module integration | Sensor + algorithm chip | Sensor + light source + lens | Single chip |
| Unlocking speed | 0.2-0.5 sec | 0.3-0.6 sec | 0.1-0.2 sec |
| Module cost | $6-25 | $3-10 | $1-3 |
| Market trend | Rapid growth (replacing optical) | Declining in mid/high | Declining (except budget) |
Technological Challenges & Market Drivers (2025-2026)
- Advanced OLED screen compatibility – Circularly polarized light reduces optical transmission (10-20% loss); Poly-less screens eliminate polarizer. Ultrasonic unaffected.
- Signal-to-noise ratio – Ultrasonic signal through thick display stack (0.5-1.0mm). High-voltage transmitter (10-20V), sensitive receiver. Noise filtering.
- Manufacturing yield – Bonding module to display without defects. Qualcomm + Samsung Display partnership. Yield improvement from 70% to >95%.
- Security enhancements – 3D depth map detects fake fingerprints (silicone, gelatin, paper). AI liveness detection (blood flow, pulse).
Real-World User Case Study (2025-2026 Data):
Samsung Galaxy S24 series (2025) uses Qualcomm 3D Sonic Max (large-size chip module, 20x30mm). Compared to Galaxy S23 (optical module). Results:
- Unlock speed: 0.2s (S24) vs. 0.4s (S23) – 50% faster.
- Wet screen: S24 works with water droplets; S23 fails.
- Anti-spoofing: S24 detects fake 2D prints; S23 vulnerable.
- User satisfaction: 94% (S24) vs. 78% (S23).
- Module cost: $20 (large-size ultrasonic) vs. $8 (optical). Phone price $1,200 vs. $1,100 – acceptable.
- Conclusion: Samsung now uses ultrasonic across all flagship models. Mid-range transitioning to small-size chips in 2026.
Exclusive Industry Outlook (2027–2032):
Three strategic trajectories by 2028:
- Large-size premium tier (Qualcomm, Goodix) — 25-30% CAGR (fastest-growing). $15-25. Flagship phones. Qualcomm dominant.
- Small-size mid-tier (Qualcomm low-cost, Goodix, GigaDevice, Fingerprint Cards) — 15-20% CAGR. $6-12. Mid-range phones, replacing optical.
- Value/optical persistence tier (OFILM, Q Technology, BOE, S-king) — stable in low-end ($100-200 phones). $3-6.
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